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| EC1019B Product Features DC - 4 GHz +19.5 dBm P1dB at 2 GHz +31 dBm OIP3 at 2 GHz 18.5 dB Gain at 2 GHz 2.8 dB Noise Figure Available in Lead-free / green SOT-89 Package Style * Internally matched to 50 * * * * * * InGaP HBT Gain Block Product Description The EC1019B is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 2000 MHz, the EC1019B typically provides 18.5 dB of gain, +31 dBm Output IP3, and +19.5 dBm P1dB. The EC1019B consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in low-cost, surface-mountable plastic lead-free/green/RoHS-compliant SOT-89 packages. A SOT-86 version is also available as the EC1019C. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the EC1019B will work for other various applications within the DC to 4 GHz frequency range such as CATV and mobile wireless. Functional Diagram GND 4 1 RF IN 2 GND 3 RF OUT Applications * * * * * Mobile Infrastructure CATV / FTTX W-LAN / ISM RFID WiMAX / WiBro Function Input Output/Bias Ground Pin No. 1 3 2, 4 Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current Typical Performance (1) Units MHz MHz dB dB dB dBm dBm dB V mA Min DC 16.5 Typ 2000 18.4 16.5 10.5 +19.5 +31 2.9 4.7 70 Max 4000 20.5 Parameter Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure Units MHz dB dB dB dBm dBm dB 500 20.9 -21.5 -17.3 +19 +34 2.5 Typical 900 20.4 -19.2 -15.1 +19 +34 2.6 1900 18.5 -16.6 -10.6 +19.5 +31 2.8 2140 18.2 -16.9 -10.2 +19 +31 2.9 +14.5 4.2 5.2 1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +6V, Rbias = 16.5, 50 syystem. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature Rating -40 to +85 C -55 to +150 C 130 mA +12 dBm +250 C Ordering Information Part No. EC1019B-G EC1019B-PCB Description InGaP HBT Gain Block (lead-free/green/RoHS-compliant SOT-89 package) 700 - 2400 MHz Fully Assembled Eval. Board Specifications and information are subject to change without notice Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 1 of 4 April 2007 EC1019B Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB InGaP HBT Gain Block Typical Device RF Performance Supply Bias = +6 V, Rbias = 15 , Icc = 70 mA 100 21.2 -23.7 -19.0 +19.4 +33 2.9 500 20.9 -21.5 -17.3 +19.4 +33.2 2.5 900 20.4 -19.2 -15.1 +19.4 +33.6 2.6 1900 18.5 -16.6 -10.6 +19.5 +31 2.8 2140 18.2 -16.9 -10.2 +19.0 +31 2.9 2400 17.6 -18.2 -10.2 +18.8 +30.7 3500 15.6 -11.2 -8.1 +16.2 5800 11.3 -9.5 -6.2 1. Test conditions: T = 25 C, Supply Voltage = +6 V, Device Voltage = 4.7 V, Rbias = 16.5 , Icc = 70 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. S21 vs. Frequency S11, S22 vs. Frequency Icc vs. Vde 160 120 25 0 S11,S22 (dB) -5 20 S21 (dB) 15 10 5 +25 C Icc (mA) -10 -15 -20 -25 S22 80 40 25C 0 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 S11 0 0 1 2 Frequency (GHz) OIP3 vs. Frequency 40 35 3 4 0 1 2 Frequency (GHz) 3 4 Vde (V) P1dB vs. Frequency 24 Noise Figure vs. Frequency 5 4 OIP3 (dBm) 3 2 1 30 25 20 500 25C 1000 1500 85C 2000 -40C 2500 3000 NF P1dB (dBm) NF (dB) 20 16 25C 85C -40C 2500 3000 0 0 500 1000 1500 2000 2500 Frequency (MHz) 12 500 1000 Frequency (MHz) 1500 2000 Frequency (MHz) Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 4 April 2007 EC1019B Vcc Icc = 70 mA InGaP HBT Gain Block Recommended Application Circuit R4 Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke RF IN EC1019B C1 Blocking Capacitor C2 Blocking Capacitor RF OUT Reference Designator L1 C1, C2, C4 50 820 nH .018 F Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF Recommended Bias Resistor Values 2500 18 nH 56 pF 3500 15 nH 39 pF Supply Voltage 6V 7V 8V 9V 10 V 12 V R1 value 16.4 ohms 30.7 ohms 45 ohms 59 ohms 74 ohms 102 ohms Size 0805 1210 1210 2010 2010 2512 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance: Ref. Desig. L1 C1, C2 C3 C4 R4 Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 F chip capacitor Do Not Place 15 1% tolerance Size 0603 0603 0603 0805 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended. Typical Device S-Parameters S-Parameters (Vdevice = +4.7 V, ICC = 70 mA, T = 25 C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 -23.95 -21.49 -18.50 -16.41 -16.74 -18.80 -18.23 -11.23 -10.23 -15.66 -15.34 -10.30 -8.84 -10.27 -53.11 -96.14 -136.32 -169.66 170.71 -170.30 156.68 101.48 57.53 96.95 75.00 47.92 21.26 20.93 20.23 19.32 18.38 17.40 16.26 15.62 14.56 14.06 12.53 12.25 11.61 177.77 159.51 141.23 124.62 110.93 95.50 86.90 73.24 67.04 52.87 44.96 30.08 22.08 -23.34 -23.02 -22.37 -21.62 -20.72 -19.86 -19.10 -18.20 -17.79 -17.02 -16.79 -16.32 -15.68 1.00 8.39 14.81 19.01 22.20 22.10 22.75 21.01 19.02 14.17 10.83 6.34 4.21 -19.31 -17.25 -14.71 -12.45 -10.32 -10.16 -10.15 -8.08 -6.62 -7.84 -8.00 -6.73 -5.91 -6.11 -58.78 -100.42 -132.99 -161.53 167.27 154.27 139.29 107.37 82.18 69.95 57.27 36.46 Device S-parameters are available for download off of the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 3 of 4 April 2007 EC1019B InGaP HBT Gain Block EC1019B-G Mechanical Information This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu.It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with an "1019G" designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an "1019" designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the "Application Notes" section. MSL / ESD Rating Land Pattern ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth Rating -40 to +85 C 128 C/W Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 4 April 2007 |
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